Our Bonding Division has over 20 new automated ultrasonic bonding machines and pick and placement machines to support production.
This Division has been very active since 2005. Products produced include: digital products, MP5 SD card, SIM card, FLASHmemory, computer peripheral products and so on. Our bonding process is done in a clean room and under very strict quality control system. We offer only quality COB processing services and ultra-thin package, and realize a steady output of 2.5 million lines permonth.
Simple Production Flow Chart
Before Bonding Process：
For Bonding Process, please contact