Bonding Process-Apexto Electronics Company Limited
www.apexto.comThe official website of Apexto Electronics Company Limited

 

Our Bonding Division has over 20 new automated ultrasonic bonding machines and pick and placement machines to support production.

This Division has been very active since 2005.  Products produced include: digital products, MP5 SD card, SIM card, FLASHmemory, computer peripheral products and so on.  Our bonding process is done in a clean room and under very strict quality control system.  We offer only quality COB processing services and ultra-thin package, and realize a steady output of 2.5 million lines permonth.

 

Simple Production Flow Chart


Before Bonding Process:

 
 
After Bonding Process:



For Bonding Process, please contact


TEL :86-755-89816655    

FAX: 86-755-89826655  

E-mail:sales@apexto.com

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